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8層翻蓋手機PCB設計

8層翻蓋手機PCB設計


1、HDI  2+N+2

2、最小BGA PIN間距 0.5MM

3、最小線寬\間距 3.5MIL

4、最小6MIL過孔

5、板厚1.6MM

6、阻抗值 50 ohm  90 ohm 100 ohm

7、驗收標準 IPC2



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